Back Grinding wheelApplication of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Grinding Machines: Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond, Resin bond
Diameter (mm): D175, D195, D209, D305, D335, etc
Manufacturing Processes for Silicon Wafers: Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
Silicon grinding wheels are mainly used for trimming of sili...
Diamond Wheels for Surface Grinding Various Wafer