Back Grinding wheel

Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Grinding Machines: Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond, Resin bond
Diameter (mm): D175, D195, D209, D305, D335, etc
Manufacturing Processes for Silicon Wafers: Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......