Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spray Coating Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding

Back Grinding wheel
Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.Grinding Machines: Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond, Resin bond
Diameter (mm): D175, D195, D209, D305, D335, etc
Manufacturing Processes for Silicon Wafers: Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
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Silicon grinding wheels are mainly used for trimming of sili...
Back Grinding Wheel for Surface Grinding Various Silicon Waf...
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Application: LED industry for back grinding of sapphire waf...
Back Grinding Wheel for LED Substrate
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