Products

Wafer Dicing blades

Wafer Dicing blades

Ultra - thin diamond dicing blade ( hub type and hubless type)
Binder includes: resin bond diamond dicing blade (soft bond), metal bond diamond dicing blade (medium bond) and electroformed nickel dicing blade (hard bond)
Blade thickness: 0.015 mm - 0.3 mm
Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3),glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc
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